SINGLE PASS CLEAVING OF ULTRAFAST LASER MODIFIED C-SHAPED GLASS EDGES

Abstract

We report on single-pass laser cleaving of transparent materials with C-shaped edges that exhibit 45-deg tangential angles to the surface. A holographic 3D beam splitter distributes several foci along the desired edge contours, including C-shaped edges. Single-pass, full thickness laser modifications are achieved requiring single-side access to the workpiece only without inclining the optical head. After having induced laser modifications with feed rates in the order of 100 mm/s actual separation is performed using a selective etching strategy.