The Construction of a Fully Integrated, MEMS Based, Atomic-Scale 3D Printer
DOI:
https://doi.org/10.31224/2424Keywords:
Fab-on-a-Chip (FoC), flip-chip, MEMS, nanofabrication, quenched condensed thin films, Top-down approachAbstract
We describe the construction of a fully integrated, MEMS based, 3D printer, capable of printing atomic-scale features. In this mm-scale device, we have built a complete nanofab for the manufacturing of nano scale devices and systems. The nanofab comprises surface micromachined MEMS, digitally programmable source of atoms; a stencil lithograpghy tool that uses a MEMS nanopositioner to determine where the atoms land; a substrate with on-chip leads for electrical characterization; a film thickness monitor; thermometer and heater. The device consists of three separate silicon die, flip-chip bonded to each other, forming a fully integrated, 3D system of systems. This device lets one build nano structures ranging from few atom structures up to micron scale devices. Applications range from searching for the Casimir Energy to the direct fabrication of quantum circuits, in situ, at cryogenic temperatures.
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Copyright (c) 2022 Richard Lally, Matthias Imboden, Alexander Stange, Lawrence Barrett, Diego Pérez-Morelo, David Bishop
This work is licensed under a Creative Commons Attribution 4.0 International License.