Comparison of copper and aluminum as the thermal link material for conduction-cooled accelerator cavities

Abstract

Cryocooler conduction-cooling has recently emerged as a new frontier for cryogenic cooling for superconducting radiofrequency (SRF) cavities. In this scheme, an SRF cavity is mechanically coupled to a closed-cycle cryocooler using linkages made of high thermal conductivity metals. In this note, we compare the thermal transport properties of high purity aluminum and high purity copper as applied to SRF cavity conduction cooling. We show that copper can enable faster cooldown than aluminum from room temperature to the base temperature near 4 K and behave equally well or better during steady state cavity operation near the base temperature.