Physical Dilemma of Large-Area Advanced-Node Chips: Irreversible Narrowing of Interconnect Channels

Abstract

Under the current physical laws, there are only two pathways to improve chip computing power: first, scaling down the process to increase transistor density, and second, directly expanding the chip area. Both approaches are constrained by geometric boundaries and fundamental physical laws, and have approached their limits at advanced technology nodes. Starting from geometry, quantum mechanics, thermodynamics, and statistical physics, this paper systematically demonstrates the device-level physical bottlenecks of advanced-node single chips, including quantum tunneling, voltage scaling failure, and uncontrolled statistical fluctuations. It points out the exponential yield degradation of large-area chips and reveals that Chiplet and advanced packaging only shift costs rather than eliminate fundamental contradictions caused by interconnect narrowing, such as drastic resistance increase, thermal runaway, signal crosstalk, and thermomechanical reliability failure. Results show that advanced-node chips cannot achieve large-area integration while maintaining acceptable signal integrity and heat dissipation capability. Based on physical constraints, this paper proposes the only feasible solution: mature-node Chiplet, which reduces interconnect pressure through low transistor density and implements system integration with traditional packaging, returning to a physically self-consistent design paradigm.